Thermal Putty

Moldable, reusable thermal putty for uneven gaps and mixed component heights. Where pre-cut pads do not fit, putty forms itself around VRAM, VRM and memory chips. 6 to 12 W/mK. Deciding between the two? See thermal putty vs. thermal pads. The strongest putty we carry is the Halnziye HY2612 V2 at 12.0 W/mK, followed by the proven Halnziye HY2610 at 10 W/mK.