Follow these step-by-step guides for proper application of our thermal solutions
1
Preparation
Clean the CPU/GPU surface and heatsink with isopropyl alcohol (90%+ recommended). Ensure surfaces are completely dry before application.
2
Application
Apply a small pea-sized amount (3-4mm) in the center of the CPU die. For GPUs, use a small line across the die.
3
Mounting
Carefully place the heatsink on top. Apply even pressure and secure with mounting mechanism. The paste will spread naturally.
1
Measurement
Measure the gap between components. Select pad thickness that matches or is slightly thicker than the gap (pads compress 10-30%).
2
Cutting
Cut the pad to size using scissors or a sharp knife. Ensure it covers the entire component surface without overlapping edges.
3
Removal of Protective Film
Carefully peel off the protective film from both sides of the thermal pad.
4
Placement
Place the pad on the component, ensuring full coverage. Press gently to ensure good contact. Mount heatsink with appropriate pressure.
Liquid metal is electrically conductive. Use with extreme caution.
1
Safety Precautions
WARNING: Liquid metal is electrically conductive! Use only on bare die applications. Protect surrounding components with electrical tape or nail polish.
2
Surface Preparation
Clean and degrease both surfaces thoroughly with isopropyl alcohol. Ensure surfaces are completely dry and free of any residue.
3
Application
Apply a very small amount (rice grain size) to the center of the die. Use the included applicator to spread in a thin, even layer covering the entire surface.
4
Spreading Technique
Use circular motions to spread the liquid metal until you achieve a mirror-like finish. Less is more - you should barely see the layer.
5
Mounting
Carefully mount the heatsink. Apply firm, even pressure. Check for any excess that may have squeezed out and clean immediately if found.
1
Surface Cleaning
Clean both surfaces with isopropyl alcohol and allow to dry completely.
2
Putty Preparation
Knead the thermal putty for 10-15 seconds to soften. Shape into a flat pad slightly larger than the component.
3
Application
Place the putty pad directly onto the component. Press down gently to ensure good contact and remove air bubbles.
4
Mounting
Mount the heatsink with moderate pressure. The putty will conform to surface irregularities. Reusable - can be removed and reapplied.
1
Surface Preparation
Clean CPU/GPU and heatsink surfaces thoroughly with isopropyl alcohol. Ensure completely dry.
2
Pad Placement
Remove protective film from one side. Place the phase change pad onto the CPU/GPU, centered and covering the entire die.
3
Film Removal
Remove the protective film from the top side of the pad.
4
Initial Mounting
Mount heatsink and run a stress test for 10-15 minutes. The pad will soften and conform to surface imperfections during this 'break-in' period.
5
Final Installation
After break-in, the pad solidifies for permanent, optimal thermal transfer. Do not remove heatsink after break-in period.
General Tips & Best Practices
Clean Surfaces
Use 90%+ isopropyl alcohol. Avoid touching cleaned surfaces.
Less is More
Excess thermal compound reduces performance. Use recommended amounts.
Even Pressure
Apply heatsink evenly. Tighten screws in a cross pattern.
Avoid Air Bubbles
Don't lift and reposition heatsink after mounting.
Over-Application
Too much compound can spill and cause shorts. Follow guidelines.
Mixing Products
Never mix different compounds. Clean completely before switching.