Fusion Supreme Thermal Paste: 15 W/mK Formula Overview
A closer look at Fusion Supreme: our highest-conductivity thermal paste at 15 W/mK, engineered for high-TDP CPUs, GPUs, and overclocking builds.
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Next-Gen Cooling
Amawi Technologies offers premium thermal paste, pads, liquid metal and phase-change materials – engineered for performance and reliability
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What do I need?
Every application needs the right material - here is your quick reference.
CPU / GPU Die
Thermal Paste Applied directly to the processor or GPU die. Maximum efficiency on flat surfaces.
VRAM / VRM / M.2 SSD Thermal Pad For chips with variable gap to the heatsink. Simply cut to size and place - no spreading needed.
VRAM / VRM / uneven chips Thermal Putty Mouldable, adheres to irregular chip surfaces. Stays flexible and is reusable.
CPU IHS / Heatspreader Phase Change Material Melts at operating temperature and fills gaps automatically. Mount once, never touch again.
CPU Die / Delidding Liquid Metal Highest thermal conductivity for enthusiasts and overclockers. Electrically conductive - copper and nickel-plated heatsinks only.
Our product lines - by performance tier
Thermal conductivity in W/mKEntry-Level
6,0 W/mK
Frostbite
Everyday, office, consoles
Mid-Range
8,0 W/mK
Frostbite Extreme
Gaming, laptop, repaste
High-End
12,8 W/mK
Fusion Ultra
Enthusiast, overclocking
Premium
15,0 W/mK
Fusion Supreme
Extreme, delidding, server
Range of Applications
Our thermal solutions are trusted across industries for optimal heat management in demanding applications
