FUSION SUPREME PAD

The Fusion Supreme Series thermal pads offer an exceptionally high thermal conductivity of 15.0 W/mK and ensure efficient heat transfer in demanding high-end applications. These pads are designed to meet even the highest demands in cooling high-performance processors, GPUs and other electronic components. They are characterised by their excellent adaptability as they adapt perfectly to uneven surfaces and compensate for the smallest gaps between components.

Thanks to their excellent electrical insulation, flame retardant and anti-static properties, they provide a safe and reliable solution for sensitive electronic components. With exceptional temperature resistance from -40°C to +200°C, Fusion Supreme Pads guarantee long-lasting and reliable performance, even in extreme conditions. Their soft, compressible structure allows for easy application as they can be optimally fixed by a light touch.

Engineered with German precision, FUSION SUPREME Pads offer ultimate performance and are the perfect choice for those who rely on premium cooling technology and the highest quality.

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