FUSIONSHEET PTM: Phase Change Material That Thinks for Itself

Thermal paste dries out. Thermal pads leave air gaps. We built something better.

FUSIONSHEET PTM is a phase change thermal interface material that ships as a solid sheet — easy to handle, easy to position, no mess. Once your system heats up and the material reaches its 45°C phase transition temperature, it softens into a semi-liquid state that fills every microscopic gap between your heat source and heatsink. When the system cools down, it solidifies again. No migration, no pump-out, no degradation over time.

How Phase Change Materials Work

Traditional thermal pastes rely on manual application — and that means uneven coverage, air pockets, and gradual drying that degrades performance over months and years. Thermal pads solve the application problem but can’t conform to surface irregularities the way a liquid can.

Phase change materials combine the strengths of both. At room temperature, FUSIONSHEET PTM is a solid sheet you can position and reposition without any mess — or trim to size if needed. As soon as your CPU or GPU reaches operating temperature, the material transitions to a semi-liquid state, flowing into every microscopic surface imperfection and creating near-perfect thermal contact. This transition is fully reversible — the material cycles between solid and semi-liquid indefinitely without losing performance.

The Specs That Matter

FUSIONSHEET PTM delivers where it counts:

• 8.5 W/mK thermal conductivity — competitive with high-end thermal pastes, far above standard thermal pads
• -50°C to +250°C operating range — handles everything from extreme cold storage to high-TDP server environments
• 45°C phase transition — activates right at normal CPU/GPU operating temperatures
• Electrically insulating (0 PS/m resistivity) — no risk of short circuits, safe around exposed components
• 2.6 g/cm³ density — consistent, uniform material with no filler settling

Advantages Over Thermal Paste

Thermal paste works well initially but has real long-term problems. The carrier fluid evaporates, the paste hardens, and thermal performance degrades — sometimes dramatically. This effect, known as pump-out, is accelerated by thermal cycling. With FUSIONSHEET PTM, there is no carrier fluid to evaporate. The phase change cycle is a physical property of the material itself, so performance remains stable year after year with zero maintenance.

Advantages Over Thermal Pads

Standard thermal pads maintain a fixed thickness that can’t fully conform to surface irregularities. This leaves microscopic air gaps — and air is one of the worst thermal conductors. FUSIONSHEET PTM starts as a sheet for easy handling but transitions to fill those gaps completely once it reaches operating temperature.

Applications

FUSIONSHEET PTM is designed for any scenario where long-term reliability matters more than a benchmark score on day one:

• Servers and data centers — set it and forget it, no reapplication schedule
• Gaming PCs and workstations — consistent performance without maintenance
• Industrial and embedded systems — handles the full -50°C to +250°C range
• Laptops and consoles — thin form factor, no risk of paste spilling during transport

Available Sizes

FUSIONSHEET PTM ships in three pre-cut sizes to fit common heat spreader dimensions:

• 38 x 38 mm — standard desktop CPU coverage
• 50 x 40 mm — larger IHS and GPU coverage, or trim to fit
• 80 x 40 mm — full-size GPU coverage, easy to cut down to any size

Ready to eliminate thermal paste reapplication from your maintenance routine? Check out FUSIONSHEET PTM →